Diamond Sawing Machine - HALLMARK EVOQ

AvailabilityIn Stock
CategoryLaser Cutters
Payment MethodsCash, COD, DirectDebit
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Diamond Sawing Machine - HALLMARK EVOQ Details

Features

• BREAK FREE CORING :
Utilizing in-house software, the machine effectively guides the laser beam to perform break-free coring on rough CVD Diamond.

• ACHIEVING MINIMAL KERF WIDTH:
The slices obtained from coring the diamond have an incredibly thin width, maximizing the number of slices that can be obtained from a single stone.

• ATTAINING A FINE AND UNWRINKLED STRUCTURE:
The coring process ensures the smooth structure of the rough diamond, preparing it for further processing.

• EXEMPLARY ENGINEERING:
The machines are constructed by reputable engineers, ensuring reliability and enabling maximum productivity.

• OPTIMAL RESOURCE UTILIZATION:
By cutting the rough stone into extremely thin slices, the machine significantly reduces diamond wastage, ensuring efficient use of resources.

Technical Specification

Laser Source 20 W
Laser Type EPDL
Wavelengthnm532
Beam Mode TEM00
Working PowerWatt4 – 18
CNC Table Type Ball ScrewLinear
mm160*160170*170
Resolutionmicron21
Repeatabilitymicron93
Accuracymicron52
Drive Type AC Servo
Z Axis Travelmm50
Power Supply 1 Phase, 3.4 Amp
Power ConsumptionkW0.81
Operating Environment  
Temperature / Humidity°C/RH20 – 30 / < 60%
Coolant Requirementlt/hr02-Mar
Dimensionmm950 * 730 * 1390
Computer System Intel Core i3 based CPU or Higher

*Technical specifications are subject to change without prior notice.


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Location
Industrial Area Ottawa,
Ottawa - K1V1V6
Ontario (Canada)
Sahajanand Laser Technology Limited
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