Features
• BREAK FREE CORING :
Utilizing in-house software, the machine effectively guides the laser beam to perform break-free coring on rough CVD Diamond.
• ACHIEVING MINIMAL KERF WIDTH:
The slices obtained from coring the diamond have an incredibly thin width, maximizing the number of slices that can be obtained from a single stone.
• ATTAINING A FINE AND UNWRINKLED STRUCTURE:
The coring process ensures the smooth structure of the rough diamond, preparing it for further processing.
• EXEMPLARY ENGINEERING:
The machines are constructed by reputable engineers, ensuring reliability and enabling maximum productivity.
• OPTIMAL RESOURCE UTILIZATION:
By cutting the rough stone into extremely thin slices, the machine significantly reduces diamond wastage, ensuring efficient use of resources.
Technical Specification
Laser Source | 20 W | ||
Laser Type | EPDL | ||
Wavelength | nm | 532 | |
Beam Mode | TEM00 | ||
Working Power | Watt | 4 – 18 | |
CNC Table Type | Ball Screw | Linear | |
mm | 160*160 | 170*170 | |
Resolution | micron | 2 | 1 |
Repeatability | micron | 9 | 3 |
Accuracy | micron | 5 | 2 |
Drive Type | AC Servo | ||
Z Axis Travel | mm | 50 | |
Power Supply | 1 Phase, 3.4 Amp | ||
Power Consumption | kW | 0.81 | |
Operating Environment | |||
Temperature / Humidity | °C/RH | 20 – 30 / < 60% | |
Coolant Requirement | lt/hr | 02-Mar | |
Dimension | mm | 950 * 730 * 1390 | |
Computer System | Intel Core i3 based CPU or Higher |
*Technical specifications are subject to change without prior notice.